The Honor Magic 3 has been leaked, an upcoming top device from Honor. We get to see a large camera sensor on the back and a borderless screen with curved edges. The device appears with the new Snapdragon 888+ chipset.
Honor Magic 3
Honor is back and now lives on as a brand that works completely independently of Huawei. Recently, the brand introduced its Honor 50 series of budget flagships in China, and it seems that the brand is also targeting Europe this summer.
However, the brand does not stick to the Honor 50 series, because there is also a premium phone on the way: the Honor Magic 3. That smartphone series has been known for years for progressive designs, such as the slide mechanism of the Magic 2.
It seems that the successor to that phone will again come with a borderless screen, but this time because there is a selfie camera under the panel. Also, we see very small screen bezels on the sides, and the panel has a very strong bend. In addition, we note that the phone has three cameras with a very large main sensor. The exact specifications are not yet known.
Snapdragon 888 Plus
The renders are from the Chinese tipster Tech Agent who shares them in a tweet. He immediately mentions that he found the renders at a rumor distributor on the Chinese social media site Weibo and that he cannot confirm whether they are real. So take the pictures with a grain of salt for now.